Memory-Niche dynamic random access memory

Model	Speed Grade	Voltage	CL-tRCD-tRP	Package	Organization	Status
W9425G6EH	CL2.5//-6/-6I/166 MHz	2.5V ±0.2V		Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant	16Mbitx16/4 Banks	NRFND
W9425G6JH	CL3//-5/-5I/-5A/200 MHz	2.4V~2.7V		Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant	16Mbitx16/4 Banks	P
W9425G6JB	CL3//-5/-5I/200 MHz	2.5V ±0.2V		Packaged in 60 Ball TFBGA, using lead free materials with RoHS compliant	16Mbitx16/4 Banks	P
W9425G8EH	CL3//-5/200 MHz	2.5V±0.2V		Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant	32Mbitx8/4 Banks	EOL
W9751G6JB	DDR2-1066//-18	1.8V±0.1V	5-5-5	WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant	32Mbitx16/4 Banks	P
W9751G8JB	DDR2-1066//-18	1.8V±0.1V	5-5-5	WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant	64Mbitx8/4 Banks	P
W9812G2IH	CL3//-6/-6I/-6A/166 MHz	2.7V~3.6V		Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant	4Mbit x16/4 Banks	P
W9812G2IB	CL3//-6/-6I/-6A/166 MHz	2.7V~3.6V		Packaged in TFBGA 90 Ball(8x13mm2 ), using Lead free materials with RoHS compliant	4Mbit x16/4 Banks	P
W9812G6IH	CL3//-5/200 MHz	3.3V±0.3V		TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant	8Mbit x16/4 Banks	NRFND
W9812G6JH	CL3//-5/200 MHz	3.3V±0.3V		TSOP II 54-pin, 400 mil using Lead free with RoHS compliant	8Mbit x16/4 Banks	P
W9816G6IB	CL3//-6/-6I/166 MHz	2.7V~3.6V		Packaged in VFBGA 60 balls pitch=0.65mm, using Lead free materials with RoHS compliant	1Mbit x16/2 Banks	P
W9816G6IH	CL2//-5/143 MHz	2.7V~3.6V		Package in 50-pin, 400 mil TSOP II, using Lead free materials with RoHS compliant	1Mbit x16/2 Banks	P
W9864G2IB	CL3//-6/166 MHz	2.7V~3.6V		Packaged in TFBGA 90 ball(8x13mm2 ), using Lead free materials with RoHS compliant	2Mbit x32/4 Banks	P
W9864G2IH	CL3//-5/200 MHz	2.7V~3.6V		Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant	2Mbit x32/4 Banks	P
W9864G6IH	CL3//-5/200 MHz	2.7V~3.6V		Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant	4Mbit x16/4 Banks	NRFND
W9864G6JH	CL3//-5/200 MHz	2.7V~3.6V		Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant	4Mbit x16/4 Banks	P
W631GG6KB	DDR3-1333//-15/15I	1.5V±0.075V	11-11-11	Packaged in WBGA 96 Ball (9x13mm2), using Lead free materials with RoHS compliant	64Mbitx16/8 Banks	P
W631GG8KB	DDR3-1333//-15/15I	1.5V±0.075V	11-11-11	Packaged in WBGA 78 Ball (8x10.5mm2), using Lead free materials with RoHS compliant	128Mbitx8/8 Banks	P
W9412G2IB	CL2.5//-6/-6I/166 MHz	2.5V ±0.1V		Packaged in 144L LFBGA, using Lead free materials with RoHS compliant	4Mbitx32/4 Banks	P
W9412G6IH	CL2.5//-6/-6I/166 MHz	2.5V ±0.1V		Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant	8Mbitx16/4 Banks	NRFND

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