| W9412G6JB |
CL3//-5/200 MHz |
2.5V±0.2V |
|
Packaged in 60 Ball(8x13mm2)TFBGA, using Lead free materials with RoHS compliant |
8Mbitx16/4 Banks |
P |
| W9412G6JH |
CL3//-5/-5I/-5K/200 MHz |
2.4V~2.7V |
|
Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant |
8Mbitx16/4 Banks |
P |
| W9464G6IH |
CL2.5//-6/-6I/166 MHz |
2.5V±0.2V |
|
Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant |
4Mbitx16/4 Banks |
NRFND |
| W9464G6JH |
CL3//-5/-5I/200 MHz |
2.4V~2.7V |
|
Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant |
4Mbitx16/4 Banks |
P |
| W9712G6JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 84 Ball (8x12.5mm2), using Lead free materials with RoHS compliant |
8Mbitx16/4 Banks |
P |
| W9712G8JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (8x12.5mm2), using Lead free materials with RoHS compliant |
16Mbitx8/4 Banks |
P |
| W971GG8JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (8x12.5mm2), using Lead free materials with RoHS compliant |
128Mbitx8/8 Banks |
P |
| W9725G2JB |
DDR2-800//-25 |
1.8V±0.1V |
5-5-5/6-6-6 |
TFBGA 128 Ball (10.5X13.5 mm2), using Lead free materials with RoHS compliant |
8Mbitx32/4 Banks |
P |
| W9725G6JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
16Mbitx16/4 Banks |
P |
| W9725G6KB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
16Mbitx16/4 Banks |
P |
| W9725G8JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
32Mbitx8/4 Banks |
P |
| W9725G8KB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
32Mbitx8/4 Banks |
P |
| W972GG6JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 84 Ball (11x13mm2), using Lead free materials with RoHS compliant |
128Mbitx16/8 Banks |
P |
| W972GG8JB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (11x11.5mm2), using Lead free materials with RoHS compliant |
256Mbitx8/8 Banks |
P |
| W9751G6KB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
32Mbitx16/4 Banks |
P |
| W9751G8KB |
DDR2-1066//-18 |
1.8V±0.1V |
5-5-5 |
WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant |
64Mbitx8/4 Banks |
P |
| W9812G6JB |
CL3//-6/-6I/166 MHz |
3.3V±0.3V |
|
Packaged in TFBGA 54 Ball(8x8mm2 ), using Lead free materials with RoHS compliant |
8Mbit x16/4 Banks |
P |
| W9825G2JB |
CL3//-6/166 MHz |
2.7V~3.6V |
|
90 Balls TFBGA, using Lead free materials with ROHS compliant |
8Mbit x16/4 Banks |
P |
| W9825G6EH |
CL2//-6/133 MHz |
3.3V±0.3V |
|
Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant |
16Mbit x16/4 Banks |
NRFND |
| W9825G6JB |
CL3//-6/-6I/166MHz |
3.3V±0.3V |
|
Packaged in TFBGA 54 Ball(8x8mm2), using Lead free materials with RoHS compliant |
16Mbit x16/4 Banks |
P |
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