Model | Description | RoHS |
---|---|---|
Allegro Package Designer | Provides a complete constraint- and rules-driven substrate layout and interconnect environment. Optimized for single die or side by side die designs. | No |
Allegro Package SI | Delivers a virtual prototyping design and simulation environment for IC packages using accurate 3D simulation models. Direct read/write from the design database provides fast, accurate models for critical design decisions. | No |
Cadence 3D Design Viewer | Provides 3D visualization and wirebond design rule checking (DRC) for IC packages. Enables collaborative markups in a solid model viewer to modify wirebond profiles. | No |
Cadence SiP Co-Design | Flexible chip-package co-design methodologies with supporting utilities allow for customizable co-design flows that meet the organizational challenges associated with collaboration between chip and package design teams that may be globally distributed. | No |
Cadence SiP Digital Architect | Enables experimentation at the initial design stages for maximum functional density and performance. Evaluates tradeoffs and provides co-design optimization of IC I/O padring/array. Optimized for co-design with Encounter Digital Implementation System. | No |
Cadence SiP Digital SI | Integrates digital SI analysis and interconnect extraction using SPICE-based simulation and embedded integration of a third-party 3D field solver. Permits interactive editing of die-to-die and substrate interconnects. | No |
Cadence SiP Layout | Provides a complete constraint- and rules-driven substrate layout and interconnect environment. Optimized for single die, side by side die, and stacked die designs and also provides the foundation for chip-package co-design with Encounter or Virtuoso. | No |
Cadence Virtuoso SiP Architect | Delivers a single schematic and simulation solution for RF/analog ICs and complex IC package substrates. Supports package substrate-level passive structures based on Pcell technology. Also enables chip-package co-design with Virtuoso. | No |
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