HF70ACC201209-T

品牌:TDK
描述:
包装:Blister (Plastic)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
经营商:科通芯城自营
参数 数值
保存温度范围-Min -40Cel
主体纵长(W)-Nom 1.25 mm
阻抗-Nom 10Ohm
阻抗容差-Max 25%
尺寸代码 2012
重量-Nom 0.01g
包装形式 Blister (Plastic)Taping [180mm Reel]
额定电流-Max 1.5A
适用焊接方法 Reflow,Iron Soldering
形状 Chip
最少供货数-Nom 2000Pcs
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
使用温度范围-Max 85Cel
最少包装数-Nom 2000Pcs
工艺 MULTI-LAYER
保存温度范围-Max 85Cel
主体横宽(L)-Nom 2 mm
电路数-Nom 1
使用温度范围-Min -25Cel
主体高度(T)-Nom 0.9 mm
直流电阻-Max 0.03Ohm
表面安装分类 Yes
概要
With 4 types rated at 1.5A and 3 types rated at 3A, and with a range of frequency characteristics available for each type, the ACC series facilitates selection of the most appropriate part for any given application.
用途
General EMI suppression.(RADIATION,IMMUNITY) For PC,CD-ROM,DVD and DVD-ROM,TV,VIDEO CAMERA,PDP,LCD-PANEL,MOBIL COMMUNICATIONS etc.
特点
Effective EMC suppression over a broad band can be achieved simply be inserting this product into the DC power line on the circuit board.It is a product conforming to RoHS directive.

文档(Document)

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