HF50ACB322513-T

品牌:TDK
描述:
包装:Blister (Plastic)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
经营商:科通芯城自营
参数 数值
使用温度范围-Min -25Cel
表面安装分类 Yes
最少包装数-Nom 2000Pcs
保存温度范围-Max 85Cel
阻抗-Nom 60Ohm
直流电阻-Max 0.3Ohm
工艺 MULTI-LAYER
电路数-Nom 1
形状 Chip
最少供货数-Nom 2000Pcs
主体纵长(W)-Nom 2.5 mm
阻抗容差-Max 25%
重量-Nom 0.046g
使用温度范围-Max 85Cel
额定电流-Max 0.4A
主体横宽(L)-Nom 3.2 mm
适用焊接方法 Reflow,Iron Soldering
保存温度范围-Min -40Cel
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
主体高度(T)-Nom 1.3 mm
尺寸代码 3225
包装形式 Blister (Plastic)Taping [180mm Reel]
概要
This extensive series completely covers impedance values ranging from 7 to 125ohm[100MHz] and can be applied to a wide range of circuits.
用途
General EMI suppression.(RADIATION,IMMUNITY) For PC,CD-ROM,DVD and DVD-ROM,TV,VIDEO CAMERA,PDP,LCD-PANEL,MOBIL COMMUNICATIONS etc.
特点
The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30 materials. The most suitable component can be selected for the circuit pattern and the suppression band.These components are applicable for both flow and reflow solderings, and have outstanding physical characteristics such as excellent terminal strength, body strength, resistance to soldering heat, solderability and mounting reliability.It is a product conforming to RoHS directive.

文档(Document)

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