| 参数 |
数值 |
| 形状 |
Chip-Array |
| 保存温度范围-Min |
-25Cel |
| 共模阻抗容差-Max |
20% |
| 额定电流-Max |
0.1A |
| 主体横宽(L)-Nom |
1.6 mm |
| 适用焊接方法 |
Reflow,Iron Soldering |
| AC/DC分类 |
DC |
| 直流电阻-Max |
1.69Ohm |
| 表面安装分类 |
Yes |
| 最少包装数-Nom |
4000Pcs |
| 共模阻抗容差-Min |
-20% |
| 使用温度范围-Max |
85Cel |
| 最少供货数-Nom |
4000Pcs |
| 共模阻抗测定频率-Nom |
100 MHz |
| 使用温度范围-Min |
-25Cel |
| 共模阻抗-Typ |
65Ohm |
| 额定电压-Max |
5V |
| 绝缘电阻-Min |
10 MOhm |
| 主体高度(T)-Nom |
0.4 mm |
| 元件数(电路数)-Nom |
4 |
| 线数-Nom |
4 |
| 主体纵长(W)-Nom |
0.8 mm |
| 尺寸代码 |
1608 |
| 重量-Nom |
0.004g |
| 包装形式 |
Blister (Plastic)Taping [180mm Reel] |
| 保存温度范围-Max |
85Cel |
概要
The TCM1608G (L1.6xW0.8xT0.4mm) is a dual-circuit modularized common mode filter array that is in the smallest class in the industry.
用途
High speed interface(LVDS, IEEE1394 and USB2.0) in electronics devices, PDP/LCD/DLP/PJ TVs, DVD players, notebook PCs, DVC, DSC, amusement machines, portable audio, digital cellular phones, etc.
特点
By providing wide bandwidth (cutoff frequency: 3GHz) for differential mode, this product has almost no effect for highspeed differential signals and can suppress the radiated emission.This product contains no lead and supports lead-free soldering.
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