参数 |
数值 |
使用温度范围-Min |
-25Cel |
包装形式 |
Blister (Plastic)Taping [180mm Reel] |
保存温度范围-Max |
85Cel |
AC/DC分类 |
DC |
最少供货数-Nom |
4000Pcs |
主体纵长(W)-Nom |
1 mm |
绝缘电阻-Min |
1 MOhm |
表面安装分类 |
No |
最少包装数-Nom |
4000Pcs |
形状 |
Chip |
保存温度范围-Min |
-25Cel |
额定电压-Max |
10V |
元件数(电路数)-Nom |
2 |
尺寸代码 |
1210 |
使用温度范围-Max |
85Cel |
额定电流-Max |
100 mA |
主体横宽(L)-Nom |
1.25 mm |
适用焊接方法 |
Reflow,Iron Soldering |
共模阻抗-Min |
60Ohm |
线数-Nom |
2 |
共模阻抗测定频率-Nom |
100 MHz |
共模阻抗-Typ |
90Ohm |
主体高度(T)-Nom |
0.57 mm |
直流电阻-Max |
1.75Ohm |
重量-Nom |
0.0037g |
概要
Common mode filter for improving EMC with an ESD protection element (ESD suppressor) using thin-film processing and material technology acquired from HDD head manufacturing.
用途
Suppressing noise and ESD for high-speed differential signal interfaces such as USB 2.0 and HDMI for mobile devices such as mobile phones, smartphones, digital cameras, and portable music players, and general consumer products.
特点
One component can be used for suppressing common mode noise and ESD.Greatly reduces the number of components and installation area.By providing wide bandwidth (cutoff frequency: 3GHz min.) for differential mode, this product has almost no effect for highspeed differential signals and can suppress the radiated emission.This product contains no lead and supports lead-free soldering.