NTCG203SH333JT1

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
类别:热敏电阻
经营商:科通芯城自营
参数 数值
类型 Chip Type
最少供货数-Nom 2000Pcs
主体高度(T)-Nom 0.7 mm
最少包装数-Nom 2000Pcs
使用温度范围-Max 125Cel
公称B常数(B25/50)-Typ 3782K
公称B常数的容许差 +/-3%
尺寸代码 2012
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
主体纵长(W)-Nom 1.25 mm
表面安装分类 No
重量-Nom 0.0072g
公称B常数(B25/85)-Typ 3850K
保存温度范围-Min -40Cel
公称零负荷电阻值的容许差 +/-5%
使用温度范围-Min -40Cel
公称零符合电阻值-Typ 33 kOhm
最大功率-Max 230 mW
保存温度范围-Max 125Cel
主体横宽(L)-Nom 2 mm
适用焊接方法 Reflow
概要
This parts are eco-friendly product which does not contain a lead. It can choose from wide range resistance series.From 470ohms to 150Kohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC “RoHS”.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

文档(Document)

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