| 参数 |
数值 |
| 尺寸代码 |
2012 |
| 包装形式 |
Punched (Paper)Taping [180mm Reel] |
| 依据国际标准 |
JIS C 2570 |
| 适用焊接方法 |
Reflow |
| 公称Ｂ常数(B25/85)-Typ |
3250K |
| 类型 |
Chip Type |
| 最少供货数-Nom |
2000Pcs |
| 公称零符合电阻值-Typ |
680Ohm |
| 主体高度(T)-Nom |
0.7 mm |
| 最少包装数-Nom |
2000Pcs |
| 使用温度范围-Max |
125Cel |
| 保存温度范围-Min |
-40Cel |
| 公称Ｂ常数(B25/50)-Typ |
3232K |
| 公称零负荷电阻值的容许差 |
+/-5% |
| 使用温度范围-Min |
-40Cel |
| 公称Ｂ常数的容许差 |
+/-3% |
| 最大功率-Max |
230 mW |
| 保存温度范围-Max |
125Cel |
| 主体横宽(L)-Nom |
2 mm |
| 主体纵长(W)-Nom |
1.25 mm |
| 表面安装分类 |
No |
| 重量-Nom |
0.0072g |
概要
This parts are eco-friendly product which does not contain a lead. It can choose from wide range resistance series.From 470ohms to 150Kohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC “RoHS”.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.
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