NTCG203EH471JT1

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
类别:热敏电阻
经营商:科通芯城自营
参数 数值
公称零负荷电阻值的容许差 +/-5%
公称B常数的容许差 +/-3%
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
公称B常数(B25/85)-Typ 3250K
最少供货数-Nom 2000Pcs
使用温度范围-Min -40Cel
公称零符合电阻值-Typ 470Ohm
主体高度(T)-Nom 0.7 mm
最少包装数-Nom 2000Pcs
使用温度范围-Max 125Cel
类型 Chip Type
主体纵长(W)-Nom 1.25 mm
表面安装分类 No
重量-Nom 0.0072g
保存温度范围-Min -40Cel
公称B常数(B25/50)-Typ 3232K
尺寸代码 2012
最大功率-Max 230 mW
保存温度范围-Max 125Cel
主体横宽(L)-Nom 2 mm
适用焊接方法 Reflow
概要
This parts are eco-friendly product which does not contain a lead. It can choose from wide range resistance series.From 470ohms to 150Kohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC “RoHS”.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

文档(Document)

序号 PDF 描述
1 pdfopen     pdfopen

深圳市科通技术股份有限公司    客服电话:(+86)755-26018083    邮箱:cs@comtech.cn

© Copyright 2018 www.comtech.cn | 粤ICP备19161615号 | 粤公网安备 44030502003347号