参数 |
数值 |
类型 |
Chip Type |
使用温度范围-Max |
125Cel |
公称B常数(B25/50)-Typ |
4661K |
公称零负荷电阻值的容许差 |
+/-3% |
公称B常数的容许差 |
+/-3% |
重量-Nom |
0.005g |
包装形式 |
Punched (Paper)Taping [180mm Reel] |
依据国际标准 |
JIS C 2570 |
公称B常数(B25/85)-Typ |
4750K |
保存温度范围-Min |
-40Cel |
使用温度范围-Min |
-40Cel |
主体纵长(W)-Nom |
0.8 mm |
主体高度(T)-Nom |
0.8 mm |
尺寸代码 |
1608 |
保存温度范围-Max |
125Cel |
适用焊接方法 |
Reflow |
最少供货数-Nom |
4000Pcs |
公称零符合电阻值-Typ |
220 kOhm |
表面安装分类 |
No |
最少包装数-Nom |
4000Pcs |
主体横宽(L)-Nom |
1.6 mm |
概要
A size of L1.6xW0.8xT0.8mm.It can choose from wide range resistance series.From 30ohms to 1Mohm.
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.