参数 |
数值 |
保存温度范围-Min |
-40Cel |
使用温度范围-Min |
-40Cel |
尺寸代码 |
1608 |
最大功率-Max |
230 mW |
保存温度范围-Max |
125Cel |
最少供货数-Nom |
4000Pcs |
公称B常数(B25/50)-Typ |
4096K |
主体纵长(W)-Nom |
0.8 mm |
公称B常数的容许差 |
+/-3% |
主体高度(T)-Nom |
0.8 mm |
表面安装分类 |
Yes |
包装形式 |
Punched (Paper)Taping [180mm Reel] |
依据国际标准 |
JIS C 2570 |
适用焊接方法 |
Reflow |
公称B常数(B25/85)-Typ |
4100K |
类型 |
Chip Type |
公称零负荷电阻值的容许差 |
+/-3% |
公称零符合电阻值-Typ |
2.2 kOhm |
最少包装数-Nom |
4000Pcs |
重量-Nom |
0.005g |
使用温度范围-Max |
125Cel |
主体横宽(L)-Nom |
1.6 mm |
概要
A size of L1.6xW0.8xT0.8mm.It can choose from wide range resistance series.From 30ohms to 1Mohm.
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.