NTCG163EH300HT1

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
类别:热敏电阻
经营商:科通芯城自营
参数 数值
类型 Chip Type
表面安装分类 Yes
使用温度范围-Max 125Cel
公称零负荷电阻值的容许差 +/-3%
公称B常数的容许差 +/-3%
重量-Nom 0.005g
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
主体横宽(L)-Nom 1.6 mm
适用焊接方法 Reflow
公称B常数(B25/85)-Typ 3250K
最少供货数-Nom 4000Pcs
最少包装数-Nom 4000Pcs
保存温度范围-Min -40Cel
公称B常数(B25/50)-Typ 3244K
使用温度范围-Min -40Cel
主体纵长(W)-Nom 0.8 mm
公称零符合电阻值-Typ 30Ohm
主体高度(T)-Nom 0.8 mm
尺寸代码 1608
最大功率-Max 230 mW
保存温度范围-Max 125Cel
概要
A size of L1.6xW0.8xT0.8mm.It can choose from wide range resistance series.From 30ohms to 1Mohm.
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

文档(Document)

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