NTCG062QH101HTB

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
类别:热敏电阻
经营商:科通芯城自营
参数 数值
保存温度范围-Min -40Cel
公称B常数(B25/50)-Typ 2794K
使用温度范围-Min -40Cel
主体纵长(W)-Nom 0.3 mm
主体高度(T)-Nom 0.3 mm
保存温度范围-Max 125Cel
公称零符合电阻值-Typ 100Ohm
公称B常数的容许差 +/-3%
表面安装分类 No
类型 Chip Type
公称零负荷电阻值的容许差 +/-3%
重量-Nom 0.0003g
使用温度范围-Max 125Cel
主体横宽(L)-Nom 0.6 mm
公称B常数(B25/85)-Typ 2800K
最少供货数-Nom 15000Pcs
最少包装数-Nom 15000Pcs
尺寸代码 0603
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
最大功率-Max 35 mW
适用焊接方法 Reflow
概要
This product is suited for the reduction of mounting area by the small type (0.6x0.3x0.3mm).It can choose from wide range resistance series.From 30ohms to 1Mohm
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP,etc
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

文档(Document)

序号 PDF 描述
1 pdfopen     pdfopen

深圳市科通技术股份有限公司    客服电话:(+86)755-26018083    邮箱:cs@comtech.cn

© Copyright 2018 www.comtech.cn | 粤ICP备19161615号 | 粤公网安备 44030502003347号