参数 |
数值 |
形状 |
SMD |
保存温度范围-Min |
-40Cel |
主体高度(T)-Nom |
1.8 mm |
包装形式 |
Blister (Plastic)Taping [180mm Reel] |
有无极性表示 |
No |
电感容差%-Min |
-5% |
主体横宽(L)-Nom |
2.5 mm |
自共振频率-Min |
325 MHz |
端子材质 |
Copper alloy frame solder plating(SnCu) |
电感测定频率-Nom |
25.2 MHz |
工艺 |
wire wound type |
尺寸代码 |
252018 |
使用温度范围(包括自己上升的部分)-Min |
-40Cel |
适用焊接方法 |
Flow,Reflow,Iron Soldering |
电感容差%-Max |
5% |
直流电阻-Max |
0.93Ohm |
表面安装分类 |
Yes |
上升温度 |
20 deg C |
重量-Nom |
0.025g |
额定电流-Max |
325 mA |
保存温度范围-Max |
105Cel |
最少供货数-Nom |
2000Pcs |
有无磁屏蔽 |
No |
Q-Min |
40 |
主体纵长(W)-Nom |
2 mm |
使用温度范围(包括自己上升的部分)-Max |
105Cel |
最少包装数-Nom |
2000Pcs |
额定电感-Nom |
0.56 microH |
概要
High Q-factor is provided in frequency band more than 30MHz in comparison with existing NLV25 series.
用途
Audio-visual equipment including TVs, VCRs and digital cameras.Electronic equipment used in communication infrastructures including xDSL and mobile base stations. Electronic equipment used in onboard automobile equipment including car audio.
特点
Land pattern is compatible with an existing series product.Lead-free material is used for the plating on the terminalThis product is in compliance with the RoHS Directive. These EF series with specifications that do not include exemption regulations are also available.