参数 |
数值 |
形状 |
Chip |
材质名称 |
S |
阻抗测定频率-Nom |
100 MHz |
阻抗容差-Min |
-25% |
表面安装分类 |
Yes |
最少包装数-Nom |
4000Pcs |
使用温度范围-Max |
125Cel |
使用温度范围-Min |
-55Cel |
阻抗-Nom |
180Ohm |
直流电阻-Max |
0.05Ohm |
工艺 |
multilayer type |
包装形式 |
Punched (Paper)Taping [180mm Reel] |
主体横宽(L)-Nom |
1.6 mm |
适用焊接方法 |
Reflow,Iron Soldering |
主体纵长(W)-Nom |
0.8 mm |
阻抗-Min |
135Ohm |
尺寸代码 |
1608 |
重量-Nom |
0.003g |
额定电流-Max |
2A |
保存温度范围-Max |
125Cel |
电路数-Nom |
1 |
最少供货数-Nom |
4000Pcs |
保存温度范围-Min |
-55Cel |
阻抗容差-Max |
25% |
主体高度(T)-Nom |
0.6 mm |
概要
The MPZ series provide effective EMC suppression in signal lines through simple in-series implementation. It is applicable for lead free soldering.
用途
PC,DVD,CDMA,LCD,Video game
特点
The MPZ series provide effective EMC suppression in signal lines through simple in-series implementation.It is applicable for lead free soldering.