| 参数 |
数值 |
| 形状 |
Chip |
| 阻抗测定频率-Nom |
100 MHz |
| 阻抗容差-Min |
-25% |
| 主体纵长(W)-Nom |
0.8 mm |
| 阻抗-Min |
225Ohm |
| 最少包装数-Nom |
4000Pcs |
| 重量-Nom |
0.004g |
| 使用温度范围-Max |
125Cel |
| 材质名称 |
Y |
| 使用温度范围-Min |
-55Cel |
| 阻抗容差-Max |
25% |
| 工艺 |
multilayer type |
| 包装形式 |
Punched (Paper)Taping [180mm Reel] |
| 额定电流-Max |
0.5A |
| 主体横宽(L)-Nom |
1.6 mm |
| 适用焊接方法 |
Reflow,Iron Soldering |
| 最少供货数-Nom |
4000Pcs |
| 保存温度范围-Min |
-55Cel |
| 阻抗-Nom |
300Ohm |
| 表面安装分类 |
Yes |
| 主体高度(T)-Nom |
0.8 mm |
| 直流电阻-Max |
0.3Ohm |
| 尺寸代码 |
1608 |
| 保存温度范围-Max |
125Cel |
| 电路数-Nom |
1 |
概要
This is a multilayered chip bead product with dimensions of L1.6xW0.8xT0.8mm.
用途
Personal computers, CRTs, liquid crystal display panels, printers,hard disk drives, game machines, cellular phones, etc.
特点
The MMZ series provide effective EMC suppression in signal lines through simple in-series implementation.It is applicable for lead free soldering.
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