MMZ1005F121ET000

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
经营商:科通芯城自营
参数 数值
使用温度范围-Min -55Cel
主体纵长(W)-Nom 0.5 mm
阻抗容差-Max 25%
主体高度(T)-Nom 0.5 mm
阻抗-Min 90Ohm
最少包装数-Nom 10000Pcs
工艺 multilayer type
包装形式 Punched (Paper)Taping [180mm Reel]
适用焊接方法 Reflow,Iron Soldering
形状 Chip
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
表面安装分类 Yes
重量-Nom 0.001g
使用温度范围-Max 125Cel
主体横宽(L)-Nom 1 mm
最少供货数-Nom 10000Pcs
材质名称 F
阻抗-Nom 120Ohm
直流电阻-Max 1.5Ohm
额定电流-Max 0.2A
保存温度范围-Max 125Cel
电路数-Nom 1
保存温度范围-Min -55Cel
尺寸代码 1005
概要
The MMZ series provide effective EMC suppression in signal lines through simple in-series implementation. It is applicable for lead free soldering.
用途
Personal computers, CRTs, liquid crystal display panels, printers,hard disk drives, game machines, cellular phones, etc.
特点
Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges.Size standardized for use by automatic assembly equipment.No preferred orientation.Electroplated terminal electrodes accommodate reflow soldering.High reliability due to an entirely monolithic structure.Low DC resistance structure of electrode prevents wasteful electric power consumption.

文档(Document)

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