MMZ1005D121ET000

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
经营商:科通芯城自营
参数 数值
形状 Chip
材质名称 D
尺寸代码 1005
重量-Nom 0.001g
最少供货数-Nom 10000Pcs
阻抗-Nom 120Ohm
阻抗容差-Max 25%
直流电阻-Max 0.7Ohm
阻抗-Min 90Ohm
最少包装数-Nom 10000Pcs
工艺 multilayer type
保存温度范围-Max 125Cel
保存温度范围-Min -55Cel
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
使用温度范围-Min -55Cel
表面安装分类 Yes
包装形式 Punched (Paper)Taping [180mm Reel]
主体纵长(W)-Nom 0.5 mm
主体高度(T)-Nom 0.5 mm
使用温度范围-Max 125Cel
额定电流-Max 0.3A
主体横宽(L)-Nom 1 mm
适用焊接方法 Reflow,Iron Soldering
电路数-Nom 1
概要
The MMZ series provide effective EMC suppression in signal lines through simple in-series implementation. It is applicable for lead free soldering.
用途
Personal computers, CRTs, liquid crystal display panels, printers,hard disk drives, game machines, cellular phones, etc.
特点
Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges.Size standardized for use by automatic assembly equipment.No preferred orientation.Electroplated terminal electrodes accommodate reflow soldering.High reliability due to an entirely monolithic structure.Low DC resistance structure of electrode prevents wasteful electric power consumption.

文档(Document)

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