MMZ1005A182ET000

品牌:TDK
描述:
包装:Punched (Paper)Taping [180mm Reel]
封装:
无铅情况/ROHS: 有铅
经营商:科通芯城自营
参数 数值
最少供货数-Nom 10000Pcs
材质名称 A
阻抗容差-Max 25%
工艺 multilayer type
额定电流-Max 0.2A
保存温度范围-Max 125Cel
形状 Chip
保存温度范围-Min -55Cel
直流电阻-Max 2.1Ohm
尺寸代码 1005
重量-Nom 0.001g
主体纵长(W)-Nom 0.5 mm
阻抗-Nom 1800Ohm
主体高度(T)-Nom 0.5 mm
阻抗-Min 1350Ohm
使用温度范围-Max 125Cel
主体横宽(L)-Nom 1 mm
适用焊接方法 Reflow,Iron Soldering
电路数-Nom 1
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
使用温度范围-Min -55Cel
表面安装分类 Yes
最少包装数-Nom 10000Pcs
包装形式 Punched (Paper)Taping [180mm Reel]
概要
The MMZ series provide effective EMC suppression in signal lines through simple in-series implementation. It is applicable for lead free soldering.
用途
Personal computers, CRTs, liquid crystal display panels, printers,hard disk drives, game machines, cellular phones, etc.
特点
Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges.Size standardized for use by automatic assembly equipment.No preferred orientation.Electroplated terminal electrodes accommodate reflow soldering.High reliability due to an entirely monolithic structure.Low DC resistance structure of electrode prevents wasteful electric power consumption.

文档(Document)

序号 PDF 描述
1 pdfopen     pdfopen

深圳市科通技术股份有限公司    客服电话:(+86)755-26018083    邮箱:cs@comtech.cn

© Copyright 2018 www.comtech.cn | 粤ICP备19161615号 | 粤公网安备 44030502003347号