| 参数 |
数值 |
| 使用温度范围-Min |
-55Cel |
| 主体纵长(W)-Nom |
0.5 mm |
| 阻抗容差-Max |
25% |
| 主体高度(T)-Nom |
0.5 mm |
| 阻抗-Min |
750Ohm |
| 最少包装数-Nom |
10000Pcs |
| 工艺 |
multilayer type |
| 包装形式 |
Punched (Paper)Taping [180mm Reel] |
| 适用焊接方法 |
Reflow,Iron Soldering |
| 形状 |
Chip |
| 阻抗测定频率-Nom |
100 MHz |
| 阻抗容差-Min |
-25% |
| 重量-Nom |
0.001g |
| 使用温度范围-Max |
125Cel |
| 额定电流-Max |
0.25A |
| 主体横宽(L)-Nom |
1 mm |
| 最少供货数-Nom |
10000Pcs |
| 阻抗-Nom |
1000Ohm |
| 保存温度范围-Max |
125Cel |
| 电路数-Nom |
1 |
| 材质名称 |
A |
| 保存温度范围-Min |
-55Cel |
| 直流电阻-Max |
1.2Ohm |
| 表面安装分类 |
Yes |
| 尺寸代码 |
1005 |
概要
The MMZ series provide effective EMC suppression in signal lines through simple in-series implementation. It is applicable for lead free soldering.
用途
Personal computers, CRTs, liquid crystal display panels, printers,hard disk drives, game machines, cellular phones, etc.
特点
Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges.Size standardized for use by automatic assembly equipment.No preferred orientation.Electroplated terminal electrodes accommodate reflow soldering.High reliability due to an entirely monolithic structure.Low DC resistance structure of electrode prevents wasteful electric power consumption.
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