Encounter Timing System is a full-chip static timing analysis (STA) solution providing gate-level delay calculation, signoff-level timing and signal integrity (SI) analysis, statistical timing and leakage analysis, advanced on-chip variation analysis, and advanced node functionality required for double-patterning and waveform effects.
Encounter Timing System removes the iteration bottleneck by providing a consistent, integrated Common Timing Engine for both the design implementation stage and the final timing verification stage of the design cycle. The result is correlation and convergence between implementation and signoff for faster timing closure.
Benefits
Advanced timing solution with comprehensive analysis
Delay calculation
Static timing analysis
SI analysis
Statistical timing analysis
On-chip variation analysis
Integrated with EDI System
Consistent timing analysis during implementation throughout the flow and signoff at the end of the flow
Faster design convergence and timing closure with smaller design margin
Common database infrastructure for fast setup and a consistent usage model throughout the flow
Unmatched timing signoff accuracy
Prevents excessive over-design to exceed performance, power, and area targets
Delivers accurate base delay and SI delay calculation to within 2-5% of SPICE
Leverages current source models for greater accuracy on mainstream and advanced node designs
Offers built-in critical path simulation for delay and SI correlation with SPICE
Higher throughput for shorter design cycles and faster time to design signoff
End-to-end multi-threaded timing and SI analysis for faster signoff turnaround
Concurrent multi-mode/multi-corner (MMMC) timing and SI analysis for large view-count designs
Distributed multi-CPU and multithreaded processing for maximum hardware utilization
Higher productivity to shorten tapeout schedules by weeks
Industry-renowned global timing debug to accelerate root-cause and bottleneck analysis
MMMC-aware timing debug for quick timing issue identification across all views
MMMC signoff ECO optimization and repair across all timing views for fewer ECO cycles
Supported by major foundries, ASIC, and IP vendors, and used exclusively by multiple IDMs for signoff