开发工具/系统-IC 封装和SiP设计-Allegro Package Designer

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Allegro Package Designer

品牌：Cadence

描述：Provides a complete constraint- and rules-driven substrate layout and interconnect environment. Opti

包装：

封装：

无铅情况/ROHS：有铅

类别：IC 封装和SiP设计

经营商：科通芯城自营

描述
文档

Cadence® Allegro® Package Designer enables constraint driven substrate interconnect design, extraction, modeling, and signal integrity analysis. The final design output provides automatic system-level handoffs for PCB design.

Features/Benefits

Supports a full front-to-back physical implementation flow for IC Package design
Determines the best package and substrate options early in the IC design cycle
Provides comprehensive design rule- and electrical constraint–driven layout
Incorporates design for manufacturing (DFM) methodologies
Improves design flow with intrinsic support for all industry standards
Models entire design with Cadence 3D Design Viewer

文档(Document)

序号	PDF	描述
1	Cadence Allegro PCB Design Solution Datasheet	Cadence Allegro PCB Design Solution Datasheet
2	Cadence Allegro System Interconnect Design Platform Brochure	Cadence Allegro System Interconnect Design Platform Brochure
3	Cadence IC Package Design Datasheet	Cadence IC Package Design Datasheet
4	Digital High-Speed Packaging Design and Verification Technical Paper	Digital High-Speed Packaging Design and Verification Technical Paper
5	Experience with Using Cadence SiP 1.1 Tools for Advanced SiP Designs	Experience with Using Cadence SiP 1.1 Tools for Advanced SiP Designs
6	Temperature-Aware Design of Printed Circuit Boards	Temperature-Aware Design of Printed Circuit Boards
7	Using Modules in Allegro PCB Editor: Design Reuse for Performance	Using Modules in Allegro PCB Editor: Design Reuse for Performance

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