专用IC-芯片组-QG82945GSE

参数	数值
Product name	Intel® 82945GSE Graphics and Memory Controller
Code Name	Formerly Calistoga
Datasheet	Download Datasheet
Dual Independent Display	Yes
ECC Memory	False
FSB Speed	533MHz / 667MHz
Graphics Output	UXGA
Integrated Graphics	Yes
Launch Date	Q1'06
License Required	No
Low Halogen Available	See MDDS
Max Memory	2 GB
Max Memory Bandwidth	4.2 GB/s
Max TDP	6 Watts
Number of Memory Channels	1
Package Size	27mm x 27mm

基于 45 纳米技术的单核处理器（主频：1.6 GHz；TDP：2.5 瓦）经过能耗优化，可提供出色的性能功耗比。此平台提供丰富的 I/O 功能、32 位 3D 显卡和 DDR2 支持 — 是众多嵌入式市场领域的理想选择。

英特尔® 超线程技术： 在多任务环境中提高系统响应性能
能耗优化： 支持增强型英特尔 SpeedStep® 技术，低能耗睡眠状态（C1E、C2E、C4E）二级高速缓存动态调整
英特尔® 单指令多数据流扩展（SSE）2 和英特尔® SSE3： 在复杂计算和视频解码中加快数据处理速度

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QG82945GSE

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序号	PDF	描述
1	Application Note: Designing Embedded Systems for Testability	Application Note: Designing Embedded Systems for Testability
2	Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boo	Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X
3	Datasheet: Intel® 82583V Gigabit Ethernet Controller	Datasheet: Intel® 82583V Gigabit Ethernet Controller
4	Datasheet: Intel® I/O Controller Hub 7 (ICH7)	Datasheet: Intel® I/O Controller Hub 7 (ICH7)
5	Datasheet: Mobile Intel® Atom™ Processor N270 Single Core	Datasheet: Mobile Intel® Atom™ Processor N270 Single Core
6	Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platfo	Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform
7	Power Profiling for Embedded Applications	Power Profiling for Embedded Applications
8	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
9	Product Brief: Intel® 82583V Gigabit Ethernet Controller	Product Brief: Intel® 82583V Gigabit Ethernet Controller
10	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology	Solution Brief: Smart Vending System— Dispensing Higher Profits Through Smart Technology
11	Specification Update: Intel® 82583V Gigabit Ethernet Controller	Specification Update: Intel® 82583V Gigabit Ethernet Controller
12	Specification Update: Intel® Atom™ Processor N270 Series	Specification Update: Intel® Atom™ Processor N270 Series
13	Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family	Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family
14	Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series	Thermal & Mechanical Design Guide: Intel® Atom™ Processor 200 Series
15	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets	White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
16	White Paper: Choosing the Right Storage Solution for Your Embedded Application	White Paper: Choosing the Right Storage Solution for Your Embedded Application
17	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms	White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
18	White Paper: Designing Systems without a Suspend Supply	White Paper: Designing Systems without a Suspend Supply
19	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles	White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
20	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
21	White Paper: Fanless Cooling for Embedded Applications	White Paper: Fanless Cooling for Embedded Applications
22	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms	White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
23	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
24	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I	White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
25	White Paper: Interfacing I²C Devices to Intel's SMBus Controller	White Paper: Interfacing I²C Devices to Intel's SMBus Controller
26	White Paper: JTAG 101	White Paper: JTAG 101
27	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization	White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
28	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons	White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
29	White Paper: Platform-Level error Handling Strategies for Intel® Systems	White Paper: Platform-Level error Handling Strategies for Intel® Systems
30	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts	White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
31	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines	White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
32	White Paper: Thermal Design Considerations for Embedded Applications	White Paper: Thermal Design Considerations for Embedded Applications
33	产品简介：适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组	产品简介：适用于嵌入式计算的移动式英特尔® 945GSE 高速芯片组
34	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件
35	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件	英特尔® 凌动™ N270 处理器和移动式英特尔®945GSE 高速芯片组开发套件
36	用于嵌入式计算的英特尔® 凌动™	用于嵌入式计算的英特尔® 凌动™