QG5100MCH

品牌:Intel
描述:Intel? 5100 Chipset
包装:
封装:
无铅情况/ROHS: 有铅
类别:芯片组
经营商:科通芯城自营
参数 数值
Product name Intel® 5100 Memory Controller
Code Name Formerly San Clemente
Datasheet Download Datasheet
Dual Independent Display No
ECC Memory True
FSB Speed 667MHz, 1066MHz, 1333MHz
Graphics Output None
Integrated Graphics No
Launch Date Q4'07
License Required No
Low Halogen Available See MDDS
Max Memory 48 GB
Max TDP 25.7 Watts
Number of Memory Channels 2
Package Size 38.5mm x 42.5mm
TCase 105°C

这些基于四核、双核及单核英特尔® 至强® 处理器的平台采用 45 纳米和 65 纳米制程技术;拥有出色的性能、能效和极长的生命周期支持,是进行密集计算的存储与通信应用的理想选择。


  • 英特尔® 虚拟化技术: 允许硬件平台作为多个虚拟平台。
  • Intel® 64 架构: 支持 64 位指令。
  • 多核选项: 提高应对多线程应用的性能
  • 英特尔® SSE4 指令: 47 条新指令用以提高应对媒体与高性能计算应用的性能。

交互式结构图



文档(Document)

序号 PDF 描述
1 Application Note: Alcatel-Lucent Converged IP Messaging Solution     Application Note: Alcatel-Lucent Converged IP Messaging Solution
2 Application Note: AP-485 Intel® Processor Identification and CPUID Instruction     Application Note: AP-485 Intel® Processor Identification and CPUID Instruction
3 Application Note: Designing Embedded Systems for Testability     Application Note: Designing Embedded Systems for Testability
4 Boundary Scan Description Language (BSDL): Intel® Xeon® Processor 5200 Series     Boundary Scan Description Language (BSDL): Intel® Xeon® Processor 5200 Series
5 Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers     Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers
6 Datasheet: Intel® 5100 Memory Controller Hub     Datasheet: Intel® 5100 Memory Controller Hub
7 Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
8 Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82576 Gigabit Ethernet (GbE) Controller
9 Datasheet: Intel® 82599 10 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82599 10 Gigabit Ethernet (GbE) Controller
10 Datasheet: Intel® 82599 10 Gigabit Ethernet (GbE) Controller     Datasheet: Intel® 82599 10 Gigabit Ethernet (GbE) Controller
11 Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family     Datasheet: Intel® I/O Controller Hub 9 (ICH9) Family
12 Datasheet: Quad-Core Intel® Xeon® Processor 5400 Series     Datasheet: Quad-Core Intel® Xeon® Processor 5400 Series
13 DB400/800 Differential Clock Buffer Specification     DB400/800 Differential Clock Buffer Specification
14 Design Guide: 603-Pin Socket     Design Guide: 603-Pin Socket
15 Design Guide: ITP700 Debug Port     Design Guide: ITP700 Debug Port
16 Design Guide: LGA771 Socket     Design Guide: LGA771 Socket
17 Design Guide: Voltage Regulator Module (VRM) 9.0 DC-DC Converter     Design Guide: Voltage Regulator Module (VRM) 9.0 DC-DC Converter
18 Design Guide: Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 10.0     Design Guide: Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 10.0
19 Design Guide: Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1     Design Guide: Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1
20 Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller H     Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller Hub Chipset
21 Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller H     Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller Hub Chipset
22 Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller H     Development Kit User Guide: Intel® Xeon® Processor 5000 Sequence and Intel® 5100 Memory Controller Hub Chipset
23 Intel® 5100 MCH Chipset Launch Presentation     Intel® 5100 MCH Chipset Launch Presentation
24 Power Profiling for Embedded Applications     Power Profiling for Embedded Applications
25 Product Brief: Intel® 5100 Memory Controller Hub Chipset for Embedded Computing     Product Brief: Intel® 5100 Memory Controller Hub Chipset for Embedded Computing
26 Product Brief: Intel® 82576 Gigabit Ethernet Controller     Product Brief: Intel® 82576 Gigabit Ethernet Controller
27 Product Brief: Intel® 82576 Gigabit Ethernet Controller     Product Brief: Intel® 82576 Gigabit Ethernet Controller
28 Product Brief: Intel® 82599 10 Gigabit Ethernet Controller (Network Connectivity)     Product Brief: Intel® 82599 10 Gigabit Ethernet Controller (Network Connectivity)
29 Product Brief: Intel® 82599 10 Gigabit Ethernet Controller (Network Connectivity)     Product Brief: Intel® 82599 10 Gigabit Ethernet Controller (Network Connectivity)
30 Specification Update: Intel® 5100 Memory Controller Hub (MCH) Chipset Specification Update     Specification Update: Intel® 5100 Memory Controller Hub (MCH) Chipset Specification Update
31 Specification Update: Intel® 82576 Gigabit Ethernet Controller     Specification Update: Intel® 82576 Gigabit Ethernet Controller
32 Specification Update: Intel® 82576 Gigabit Ethernet Controller     Specification Update: Intel® 82576 Gigabit Ethernet Controller
33 Specification Update: Intel® Xeon® Processor 5200 Series     Specification Update: Intel® Xeon® Processor 5200 Series
34 Specification Update: Quad-Core Intel® Xeon® Processor 5400 Series     Specification Update: Quad-Core Intel® Xeon® Processor 5400 Series
35 Thermal & Mechanical Design Guide: Intel® 5100 Memory Controller Hub Chipset     Thermal & Mechanical Design Guide: Intel® 5100 Memory Controller Hub Chipset
36 Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor 5200 Series     Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor 5200 Series
37 Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor 5200 Series in Embedded Applications     Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor 5200 Series in Embedded Applications
38 Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor L5408 Series in Embedded Applications     Thermal & Mechanical Design Guidelines: Intel® Xeon® Processor L5408 Series in Embedded Applications
39 Thermal & Mechanical Design Guidelines: Quad-Core Intel® Xeon® Processor 5400 Series     Thermal & Mechanical Design Guidelines: Quad-Core Intel® Xeon® Processor 5400 Series
40 White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets     White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets
41 White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model     White Paper: Asymmetric Multi-Processing, Embedded and Communication MC Usage Model
42 White Paper: Choosing the Right Storage Solution for Your Embedded Application     White Paper: Choosing the Right Storage Solution for Your Embedded Application
43 White Paper: Consolidating Communications and Networking Workloads onto One Architecture     White Paper: Consolidating Communications and Networking Workloads onto One Architecture
44 White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms     White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms
45 White Paper: Designing Systems without a Suspend Supply     White Paper: Designing Systems without a Suspend Supply
46 White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles     White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
47 White Paper: Extending the World’s Most Popular Processor Architecture     White Paper: Extending the World’s Most Popular Processor Architecture
48 White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms     White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms
49 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
50 White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on I     White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture
51 White Paper: Interfacing I²C Devices to Intel's SMBus Controller     White Paper: Interfacing I²C Devices to Intel's SMBus Controller
52 White Paper: Introducing the 45nm Next-Generation Intel® Core Microarchitecture     White Paper: Introducing the 45nm Next-Generation Intel® Core Microarchitecture
53 White Paper: JTAG 101     White Paper: JTAG 101
54 White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization     White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
55 White Paper: Optimizing Embedded System Performance—Impact of Data Prefetching on a Medical Imaging      White Paper: Optimizing Embedded System Performance—Impact of Data Prefetching on a Medical Imaging Application
56 White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Cons     White Paper: PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations
57 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
58 White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture     White Paper: Programming Models for Packet Processing Applications on Multi-Core Intel® Architecture Systems
59 White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts     White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts
60 White Paper: Seven Tips to Get Started on Embedded Multi-Core     White Paper: Seven Tips to Get Started on Embedded Multi-Core
61 White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines     White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines
62 White Paper: Thermal Design Considerations for Embedded Applications     White Paper: Thermal Design Considerations for Embedded Applications
63 White Paper: Thermal Guidance for AdvancedTCA Designs     White Paper: Thermal Guidance for AdvancedTCA Designs
64 White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane     White Paper: Upgrading to Multi-Core Ecosystem Keeps Car Simulator Running in the Fast Lane
65 White Paper: What Does It Mean to Be I/O Bound?     White Paper: What Does It Mean to Be I/O Bound?
66 产品简介: 45 纳米英特尔® 至强® 处理器 5400/5200 系列     产品简介: 45 纳米英特尔® 至强® 处理器 5400/5200 系列
67 开发套件: 四核和双核英特尔®至强®处理器5000系列和 英特尔®5100内存控制器芯片组开发套件     开发套件: 四核和双核英特尔®至强®处理器5000系列和 英特尔®5100内存控制器芯片组开发套件

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