HF70ACB201209-T

品牌:TDK
描述:FERRITE CHIP 10 OHM 600MA 0805
包装:Blister (Plastic)Taping [180mm Reel]
封装:0805 (2012 Metric)
无铅情况/ROHS: 无铅
经营商:科通芯城自营
参数 数值
形状 Chip
工艺 MULTI-LAYER
保存温度范围-Min -40Cel
使用温度范围-Min -25Cel
主体纵长(W)-Nom 1.25 mm
阻抗-Nom 10Ohm
阻抗容差-Max 25%
主体高度(T)-Nom 0.9 mm
尺寸代码 2012
重量-Nom 0.01g
包装形式 Blister (Plastic)Taping [180mm Reel]
主体横宽(L)-Nom 2 mm
最少供货数-Nom 2000Pcs
最少包装数-Nom 2000Pcs
使用温度范围-Max 85Cel
额定电流-Max 0.6A
保存温度范围-Max 85Cel
适用焊接方法 Reflow,Iron Soldering
电路数-Nom 1
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
直流电阻-Max 0.1Ohm
表面安装分类 Yes
系列 HF70ACB
频率对应阻抗 10 Ohm @ 100MHz
额定电流 600mA
DC电阻 100 mOhm Max
滤波器类型 Differential Mode - Single
线路数 1
安装类型 Surface Mount
最大高度 0.043" (1.10mm)
尺寸 0.079" L x 0.049" W (2.00mm x 1.25mm)
概要
This extensive series completely covers impedance values ranging from 7 to 125ohm[100MHz] and can be applied to a wide range of circuits.
用途
General EMI suppression.(RADIATION,IMMUNITY) For PC,CD-ROM,DVD and DVD-ROM,TV,VIDEO CAMERA,PDP,LCD-PANEL,MOBIL COMMUNICATIONS etc.
特点
The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30 materials. The most suitable component can be selected for the circuit pattern and the suppression band.These components are applicable for both flow and reflow solderings, and have outstanding physical characteristics such as excellent terminal strength, body strength, resistance to soldering heat, solderability and mounting reliability.It is a product conforming to RoHS directive.

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