HF70ACB453215-T

brand:TDK
Description:
Packaging:Blister (Plastic)Taping [180mm Reel]
Packaging:
Lead-free status/ROHS: Yes
Seller:科通芯城自营
Parameter Value
工艺 MULTI-LAYER
尺寸代码 4532
电路数-Nom 1
最少供货数-Nom 1000Pcs
使用温度范围-Min -25Cel
主体纵长(W)-Nom 3.2 mm
直流电阻-Max 0.4Ohm
表面安装分类 Yes
最少包装数-Nom 1000Pcs
额定电流-Max 0.3A
保存温度范围-Max 85Cel
主体横宽(L)-Nom 4.5 mm
保存温度范围-Min -40Cel
阻抗测定频率-Nom 100 MHz
阻抗容差-Min -25%
阻抗-Nom 120Ohm
主体高度(T)-Nom 1.5 mm
包装形式 Blister (Plastic)Taping [180mm Reel]
形状 Chip
阻抗容差-Max 25%
重量-Nom 0.094g
使用温度范围-Max 85Cel
适用焊接方法 Reflow,Iron Soldering
概要
This extensive series completely covers impedance values ranging from 7 to 125ohm[100MHz] and can be applied to a wide range of circuits.
用途
General EMI suppression.(RADIATION,IMMUNITY) For PC,CD-ROM,DVD and DVD-ROM,TV,VIDEO CAMERA,PDP,LCD-PANEL,MOBIL COMMUNICATIONS etc.
特点
The 2012, 3216, 3225 and 4532 types all use HF70, 50 and 30 materials. The most suitable component can be selected for the circuit pattern and the suppression band.These components are applicable for both flow and reflow solderings, and have outstanding physical characteristics such as excellent terminal strength, body strength, resistance to soldering heat, solderability and mounting reliability.It is a product conforming to RoHS directive.

文档(Document)

No. PDF Description
1 pdfopen     pdfopen

深圳市科通技术股份有限公司    consumer hotline:(+86)755-26018083   mail:cs@comtech.cn

© Copyright 2018 www.comtech.cn | 粤ICP备19161615号 |