AT80612002928AC

brand:Intel
Description:Intel? Xeon? Processor LC5518 (8M Cache, 1.73 GHz, 4.80 GT/s Intel? QPI)
Packaging:
Packaging:
Lead-free status/ROHS: Yes
Category:Xeon processor
Seller:科通芯城自营
Parameter Value
# of Cores 4
# of Memory Channels 3
# of QPI Links 1
# of Threads 8
Clock Speed 1.73 GHz
Datasheet Url Link
ECC Memory Supported Yes
Embedded Options Available Yes
Enhanced Intel SpeedStep® Technology Yes
Execute Disable Bit Yes
Idle States Yes
Instruction Set 64-bit
Intel® Demand Based Switching Yes
Intel® Hyper-Threading Technology Yes
Intel® QPI Speed 4.8 GT/s
Intel® Turbo Boost Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® VT-x with Extended Page Tables (EPT) Yes
L3 Cache 8 MB
Launch Date Q1'10
Lithography 45 nm
Low Halogen Options Available See MDDS
Max CPU Configuration 2
Max TDP 48 W
Max Turbo Frequency 2.133 MHz
PCI Express Revision 2.0
Processor Number LC5518
Recommended Customer Price TRAY: $519
Sockets Supported FCLGA1366
Status Launched
T CASE 77.5°C - 92.5°C
VID Voltage Range 1.0 - 1.5V

PCI Express* 通道集成入处理器消除了对独立 I/O 中枢芯片的需要,因而减少芯片总数,并降低总体系统功耗。此处理器提供比前代处理器更佳的性能功耗比,并结合了 PCIe* 非透明桥接、RAID 和 DRAM 自刷新等功能。


  • 多种处理器: 23W 单核到 85W 四核,支持单或双处理器配置。
  • 英特尔® 快速通道互联技术: 为数据密集型应用提供改进的带宽。
  • 英特尔® 虚拟化技术: 处理器对硬件协助虚拟化的支持以及芯片组针对直接 I/O(VT-d)的英特尔® 虚拟化技术。
  • 英特尔® 超线程技术: 提高应对并行、多线程应用的性能

交互式结构图



文档(Document)

No. PDF Description
1 Application Power Guideline Addendum: Intel® Xeon® Processor EC5549     Application Power Guideline Addendum: Intel® Xeon® Processor EC5549
2 Benchmark summary for Trenton System* Host Boards using Two, Quad-core Intel® Xeon® C5549 and Two, Q     Benchmark summary for Trenton System* Host Boards using Two, Quad-core Intel® Xeon® C5549 and Two, Quad-core Intel® Xeon® E5440 Processors
3 Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers     Case Study: Migrating the Ericsson* Operations Support System: RISC or Intel® based Servers
4 Case Study: Putting VoIP Calls to the Test     Case Study: Putting VoIP Calls to the Test
5 Datasheet: Intel® 5 Series Chipset and Intel® 3400 Series Chipset     Datasheet: Intel® 5 Series Chipset and Intel® 3400 Series Chipset
6 Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY     Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY
7 Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY     Datasheet: Intel® 82578 Gigabit Ethernet Controller PHY
8 Datasheet: Intel® Xeon® Processor C5500/C3500 Series - Volume 1 of 2     Datasheet: Intel® Xeon® Processor C5500/C3500 Series - Volume 1 of 2
9 Datasheet: Intel® Xeon® Processor C5500/C3500 Series Datasheet - Volume 2 of 2     Datasheet: Intel® Xeon® Processor C5500/C3500 Series Datasheet - Volume 2 of 2
10 Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY     Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY
11 Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY     Schematic: Intel® 82577, 82578, 82579 Gigabit Ethernet PHY
12 Solution Brief: The Right Computing Platform for Real-World Testing     Solution Brief: The Right Computing Platform for Real-World Testing
13 Specification Update: Intel® 82578 Gigabit Ethernet PHY     Specification Update: Intel® 82578 Gigabit Ethernet PHY
14 Specification Update: Intel® 82578 Gigabit Ethernet PHY     Specification Update: Intel® 82578 Gigabit Ethernet PHY
15 Specification Update: Intel® Xeon® Processor C5500/C3550 Series     Specification Update: Intel® Xeon® Processor C5500/C3550 Series
16 Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series     Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series
17 Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series     Thermal & Mechanical Design Guide: Intel® Xeon® Processor C5500/C3500 Series
18 Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Ser     Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Series Chipset
19 Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Ser     Thermal Mechanical Specifications and Design Guidelines: Intel® 5 Series Chipset and Intel® 3400 Series Chipset
20 White Paper: Choosing the Right Storage Solution for Your Embedded Application     White Paper: Choosing the Right Storage Solution for Your Embedded Application
21 White Paper: Consolidating Communications and Networking Workloads onto One Architecture     White Paper: Consolidating Communications and Networking Workloads onto One Architecture
22 White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms     White Paper: Debugging Machine Check Exceptions on Embedded IA Platforms
23 White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors     White Paper: Designing Real-Time Solutions on Embedded Intel® Architecture Processors
24 White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles     White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles
25 White Paper: First the Tick, Now the Tock: Next Generation Intel® Microarchitecture (Nehalem)     White Paper: First the Tick, Now the Tock: Next Generation Intel® Microarchitecture (Nehalem)
26 White Paper: JTAG 101     White Paper: JTAG 101
27 White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization     White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization
28 White Paper: Non-transparent Bridge on the Intel® Xeon® Processor C5500/C3500 Series     White Paper: Non-transparent Bridge on the Intel® Xeon® Processor C5500/C3500 Series
29 White Paper: Platform-Level error Handling Strategies for Intel® Systems     White Paper: Platform-Level error Handling Strategies for Intel® Systems
30 White Paper: Preparing for the New Wave of On-Demand TV Services     White Paper: Preparing for the New Wave of On-Demand TV Services
31 基于英特尔® 至强® 处理器 C5500/C3500 系列的平台     基于英特尔® 至强® 处理器 C5500/C3500 系列的平台

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